Может так оно и есть в теории,

Alex J. писал(-а):
Так говорит AMD по поводу своей памяти:
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods

еще в Toshiba
(toshiba.com/taec/components/docs/Generic/neuron/2.pdf):


Ultrasonic cleaning should not be used with hermetically-sealed ceramic packages such as a leadless chip carrier (LCC), pin grid array (PGA) or charge-coupled device (CCD), because the bonding wires can become disconnected due to resonance during the cleaning process. Even if a device package allows ultrasonic cleaning, limit the duration of ultrasonic cleaning to as short a time as possible,

Может так оно и есть в теории, но на практике никогда не замечал, что "the bonding wires can become disconnected due to resonance during the cleaning process" ... 8)

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